IPC-BOX-D6-X

IPC-BOX-D6-X



Key Features:
● High-performance Intel® Core™ processors (6th–9th Gen) with flexible chipset options.
● Fanless sealed chassis for silent and reliable operation.
● Multiple video outputs (VGA, DVI-D, HDMI) supporting diverse display setups.
● Wide voltage input (12–55V) for industrial power environments.
● Rugged design with extended temperature, vibration and shock tolerance.
● Expandable I/O including PCI/PCIe slots, GPIO, COM and USB.
 
More About This Product:

  Category   Specification
  CPU   Intel® Core™ i9/i7/i5/i3, Pentium®, Celeron® (LGA1151, 6th–9th Gen) Coffee Lake (8/9th Gen), Kaby Lake (7th Gen), Skylake (6th Gen)
  Chipset   Intel® H110 / Q170
  Memory   2 × DDR4 2133/2400/2666MHz DIMM, up to 64GB
  Display   1 × VGA, 1 × DVI-D, 1 × HDMI
  Networking   2 × Intel® i210AT, 1 × Intel® i219LM
  Storage   1 × mSATA, 1 × M.2 M-Key (2280, SATA/NVMe x4, Q170 only) 2.5" or 3.5" HDD/SSD (optional)
  RAID   0/1 (Q170)
  USB   6 × USB 3.0 (expandable)
  COM   2 × COM (expandable; TTL/RS232/422/485; optional isolation)
  GPIO   16 or 32 channels; standard or opto-isolated rugged GPIO; NPN/PNP selectable; up to 80V withstand
  Expansion Slots   1 × mini-PCIe (full-size): WiFi/4G/MVB/custom modules 1 × M.2 B-Key 3042/3052: 4G/5G modules PCIe: x16, x4 (Q170), x1; PCI legacy options
  Audio   Realtek codec, Line-out, Mic-in
  Watchdog   1–255 sec system reset
  Power Input   12V, 19V, 24V, 36V, 48V, 55V (selectable); lockable connectors
  Operating Systems   Windows 7/10/11, Linux distributions, China OS (Kylin, etc.)
  Cooling   Fanless sealed chassis, optional temperature-controlled external fan
  Mounting   Horizontal or vertical (multi-slot versions)
  Environmental   Operating: -10℃ ~ 60℃; Storage: -20℃ ~ 85℃ Humidity: 5% ~ 95% (non-condensing) Vibration (SSD): 5Grms; (HDD): 1Grms Shock (SSD): 50G / 11ms; (HDD): 20G / 11ms
  Certifications   CE, FCC, CCC